- 专利标题： MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
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申请号： US16902959申请日： 2020-06-16
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公开(公告)号： US20210391264A1公开(公告)日： 2021-12-16
- 发明人: Bai Nie , Kristof Kuwawi Darmawikarta , Srinivas V. Pietambaram , Haobo Chen , Gang Duan , Jason M. Gamba , Omkar G. Karhade , Nitin A. Deshpande , Tarek A. Ibrahim , Rahul N. Manepalli , Deepak Vasant Kulkarni , Ravindra Vijay Tanikella
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/48
摘要：
Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.
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