公开(公告)号：US20210391264A1

公开(公告)日：2021-12-16

申请号：US16902959

申请日：2020-06-16

Applicant: Intel Corporation

Inventor： Bai Nie ,  Kristof Kuwawi Darmawikarta ,  Srinivas V. Pietambaram ,  Haobo Chen ,  Gang Duan ,  Jason M. Gamba ,  Omkar G. Karhade ,  Nitin A. Deshpande ,  Tarek A. Ibrahim ,  Rahul N. Manepalli ,  Deepak Vasant Kulkarni ,  Ravindra Vijay Tanikella

IPC: H01L23/538 ,  H01L21/48

Abstract: Disclosed herein are microelectronic structures including bridges, as well as related assemblies and methods. In some embodiments, a microelectronic structure may include a substrate and a bridge.