- 专利标题: FLEX BUS PROTOCOL NEGOTIATION AND ENABLING SEQUENCE
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申请号: US17485337申请日: 2021-09-25
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公开(公告)号: US20220012203A1公开(公告)日: 2022-01-13
- 发明人: Debendra Das Sharma , Michelle C. Jen , Prahladachar Jayaprakash Bharadwaj , Bruce A. Tennant , Mahesh Wagh
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: G06F13/40
- IPC分类号: G06F13/40 ; G06F13/42
摘要:
Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.
公开/授权文献
- US11726939B2 Flex bus protocol negotiation and enabling sequence 公开/授权日:2023-08-15
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