Invention Application
- Patent Title: CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
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Application No.: US17149664Application Date: 2021-01-14
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Publication No.: US20220071000A1Publication Date: 2022-03-03
- Inventor: Tzyy-Jang Tseng , Shao-Chien Lee , John Hon-Shing Lau , Chen-Hua Cheng , Ra-Min Tain
- Applicant: Unimicron Technology Corp.
- Applicant Address: TW Taoyuan City
- Assignee: Unimicron Technology Corp.
- Current Assignee: Unimicron Technology Corp.
- Current Assignee Address: TW Taoyuan City
- Priority: TW109142148 20201201
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K3/40 ; H05K3/02 ; H05K3/00
Abstract:
The disclosure provides a circuit board structure including at least two sub-circuit boards and at least one connector. Each of the sub-circuit boards includes a plurality of carrier units. The connector is connected between the sub-circuit boards, and a plurality of stress-relaxation gaps are defined between the sub-circuit boards.
Information query
