Invention Application
- Patent Title: INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US17584877Application Date: 2022-01-26
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Publication No.: US20220149040A1Publication Date: 2022-05-12
- Inventor: Seungryul LEE , Yongseung KIM , Jungtaek KIM , Pankwi PARK , Dongchan SUH , Moonseung YANG , Seojin JEONG , Minhee CHOI , Ryong HA
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2019-0114366 20190917
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/423 ; H01L29/78 ; H01L29/06

Abstract:
An integrated circuit device includes a fin-type active region protruding from a substrate and extending in a first direction, a plurality of semiconductor patterns disposed apart from an upper surface of the fin-type active region, the plurality of semiconductor patterns each including a channel region; a gate electrode surrounding the plurality of semiconductor patterns, extending in a second direction perpendicular to the first direction, and including a main gate electrode, which is disposed on an uppermost semiconductor pattern of the plurality of semiconductor patterns and extends in the second direction, and a sub-gate electrode disposed between the plurality of semiconductor patterns; a spacer structure disposed on both sidewalls of the main gate electrode; and a source/drain region connected to the plurality of semiconductor patterns, disposed at both sides of the gate electrode, and contacting a bottom surface of the spacer structure.
Public/Granted literature
- US11676963B2 Integrated circuit device and method of manufacturing the same Public/Granted day:2023-06-13
Information query
IPC分类: