Invention Application
- Patent Title: BORON NITRIDE AGGREGATED PARTICLES, THERMAL CONDUCTIVE RESIN COMPOSITION, AND HEAT DISSIPATION MEMBER
-
Application No.: US17441266Application Date: 2020-03-25
-
Publication No.: US20220154059A1Publication Date: 2022-05-19
- Inventor: Go TAKEDA , Takaaki TANAKA
- Applicant: DENKA COMPANY LIMITED
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP2019-060286 20190327
- International Application: PCT/JP2020/013385 WO 20200325
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C01B21/064 ; C08K3/38

Abstract:
The present invention relates to aggregated boron nitride particles including hexagonal boron nitride primary particles aggregated, having a specific surface area measured by the BET method of 2 to 6 m2/g and a crushing strength of 5 MPa or more. The thermally conductive resin composition of the present invention includes the aggregated boron nitride particles of the present invention. The heat dissipation member of the present invention includes the thermally conductive resin composition of the present invention. According to the present invention, aggregated boron nitride particles that can suppress the formation of voids in a heat dissipation member and can improve the insulation breakdown characteristics and the thermal conductivity of a heat dissipation member, a thermally conductive resin composition including the aggregated boron nitride particles, and a heat dissipation member using the thermally conductive resin composition can be provided.
Information query