Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
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Application No.: US17530581Application Date: 2021-11-19
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Publication No.: US20220165596A1Publication Date: 2022-05-26
- Inventor: Tsuyoshi WATANABE , Masashi TSUCHIYAMA , Suguru ENOKIDA , Taro YAMAMOTO
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Priority: JP2020-195437 20201125
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; H01L21/683 ; G03F7/16

Abstract:
A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.
Public/Granted literature
- US11664254B2 Substrate processing apparatus and substrate processing method Public/Granted day:2023-05-30
Information query
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