公开(公告)号：US20250079215A1

公开(公告)日：2025-03-06

申请号：US18949607

申请日：2024-11-15

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

IPC: H01L21/677 ,  G03F7/16

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US20170170040A1

公开(公告)日：2017-06-15

申请号：US15378595

申请日：2016-12-14

Applicant: Tokyo Electron Limited

Inventor： Kenichi SHIGETOMI ,  Takeshi SAIKUSA ,  Eiichi SEKIMOTO ,  Takayuki FUKUDOME ,  Kousuke YOSHIHARA ,  Suguru ENOKIDA ,  Kazuhiro TAKESHITA ,  Kazuto UMEKI

IPC: H01L21/67

CPC classification number: H01L21/67248 ,  H01L21/67103 ,  H05B1/0233 ,  H05B2203/037

Abstract: A substrate processing apparatus includes plural heating modules each including a table on which a substrate is placed to be heated, the substrate having plural heated zones. The table has plural heaters each assigned to heat respective ones of the heated zones. Heat generation of the heaters is controlled independently. A control unit controls the heaters such that integrated quantities of heat of the respective heated zones given by the corresponding heaters from first to second time point are substantially identical to each other in each of the heating modules, and are substantially identical to each other among the heating modules. The first time point is set when a temperature transition profile of the substrate is rising toward a process temperature after placing the substrate on the table under a condition where heat generation of the heaters is stable. The second time point is set after the temperature transition profile reaches the process temperature.

公开(公告)号：US20140234991A1

公开(公告)日：2014-08-21

申请号：US14248765

申请日：2014-04-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yuichi DOUKI ,  Tokutarou HAYASHI ,  Naruaki IIDA ,  Suguru ENOKIDA

IPC: H01L21/68 ,  H01L21/66

CPC classification number: H01L21/68 ,  H01L21/6715 ,  H01L21/67748 ,  H01L21/681 ,  H01L21/68707 ,  H01L22/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A substrate holder positioning method, capable of positioning a substrate holder without using any positioning jig, includes: measuring a first position of a substrate held on a substrate holder included in a substrate carrying mechanism; carrying the substrate held on the substrate holder to a substrate rotating unit for holding and rotating the substrate; turning the substrate held by the substrate rotating unit through a predetermined angle by the substrate rotating unit; transferring the substrate turned by the substrate rotating unit from the substrate rotating unit to the substrate holder; measuring a second position of the substrate transferred from the substrate rotating unit to the substrate holder; determining the position of the center of rotation of the substrate rotating unit on the basis of the first and the second position; and positioning the substrate holder on the basis of the position of the center of rotation.

Abstract translation: 一种能够在不使用任何定位夹具的情况下定位基板支架的基板支架定位方法，包括：测量保持在基板承载机构中的基板保持器上的基板的第一位置; 将保持在所述基板保持器上的所述基板承载到用于保持和旋转所述基板的基板旋转单元; 通过基板旋转单元将由基板旋转单元保持的基板转动预定角度; 将由基板旋转单元转动的基板从基板旋转单元传送到基板保持器; 测量从所述基板旋转单元转移到所述基板保持器的所述基板的第二位置; 基于第一位置和第二位置确定基板旋转单元的旋转中心的位置; 并且基于旋转中心的位置来定位衬底保持器。

公开(公告)号：US20130078061A1

公开(公告)日：2013-03-28

申请号：US13623189

申请日：2012-09-20

Applicant: TOKYO ELECTRON LIMITED

Inventor： Suguru ENOKIDA ,  Masahiro NAKAHARADA ,  Hidekazu KIYAMA ,  Naruaki IIDA ,  Akira MIYATA

IPC: H01L21/677

CPC classification number: H01L21/67766 ,  H01L21/67155 ,  H01L21/67178 ,  H01L21/67769 ,  H01L21/68707

Abstract: A substrate treatment system comprise a treatment station having a plurality of treatment units provided at multiple tiers in an up-down direction, a cassette mounting table on which a cassette housing a plurality of wafers W is mounted, and a wafer transfer mechanism arranged between the treatment station and the cassette mounting table, wherein a delivery block in which a plurality of delivery units are provided at multiple tiers is provided between the treatment station and the wafer transfer mechanism, the delivery units temporarily housing a wafer to be transferred between the cassette mounting table and the treatment station and a wafer to be transferred between the tiers of the treatment units. The wafer transfer mechanism includes a first transfer arm that transfers a wafer between the cassette mounting table and the delivery block, and a second transfer arm that transfers a wafer between the tiers of the delivery units.

Abstract translation: 基板处理系统包括处理台，该处理台具有设置在上下方向的多层的多个处理单元，安装有多个晶片W的盒子的盒安装台，以及布置在 处理台和盒安装台，其中在处理站和晶片传送机构之间设置有多个传送单元设置在多层的传送块，传送单元暂时容纳要在盒安装件 桌子和治疗台以及待处理单元层之间转移的晶片。 晶片传送机构包括在盒安装台和传送块之间传送晶片的第一传送臂和在传送单元的各层之间传送晶片的第二传送臂。

公开(公告)号：US20190332014A1

公开(公告)日：2019-10-31

申请号：US16393042

申请日：2019-04-24

Applicant: Tokyo Electron Limited

Inventor： Takahiro OOKUBO ,  Suguru ENOKIDA ,  Toshinobu FURUSHO

IPC: G03F7/16

Abstract: A treatment solution supply apparatus for supplying a treatment solution to a solution treatment apparatus which applies the treatment solution to a substrate to perform a predetermined treatment, there being a plurality of solution treatment apparatuses which are supply destinations of the treatment solution, the treatment solution supply apparatus includes: a sending unit common among the plurality of solution treatment apparatuses, the sending unit being configured to send the treatment solution stored in a treatment solution supply source to each of the plurality of solution treatment apparatuses; and a control unit configured to control the sending unit, wherein the sending unit includes a plurality of pumps configured to suck the treatment solution and load the treatment solution thereinto and to send the loaded treatment solution, and wherein the control unit is configured to control suction timing of each of the plurality of pumps so that at least one of the plurality of pumps becomes a state capable of sending the treatment solution to the plurality of solution treatment apparatuses at all times.

公开(公告)号：US20150219994A1

公开(公告)日：2015-08-06

申请号：US14626295

申请日：2015-02-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Nobuaki MATSUOKA ,  Akira MIYATA ,  Shinichi HAYASHI ,  Suguru ENOKIDA ,  Hiroshi TOMITA ,  Makoto HAYAKAWA ,  Tatsuhei YOSHIDA

IPC: G03F7/16

CPC classification number: G03F7/16 ,  H01L21/6715

Abstract: In one embodiment, a coating and developing apparatus includes a processing block having two early-stage coating unit blocks, two later-stage coating unit blocks and two developing unit blocks, each unit blocks being vertically stacked on each other, The apparatus has at least two operation modes M1 and M2 adapted for abnormality. In mode M1 the processing module that processed the abnormal substrate in the developing unit blocks is identified, and subsequent substrates are transported to the processing module or modules, of the same type as the identified processing module, other than the identified processing module. In mode M2, the developing unit block that processed the abnormal substrate is identified, and subsequent substrates are transported to the developing unit block other than the identified developing unit block.

Abstract translation: 在一个实施例中，涂层和显影装置包括具有两个早期涂覆单元块，两个后期涂层单元块和两个显影单元块的处理块，每个单元块彼此垂直堆叠。该装置至少具有 适用于异常的两种操作模式M1和M2。 在模式M1中，识别处理显影单元块中的异常衬底的处理模块，并且随后的衬底被传送到除了所识别的处理模块之外的与所识别的处理模块相同类型的处理模块。 在模式M2中，识别处理异常衬底的显影单元块，并且随后的衬底被传送到除了所识别的显影单元块之外的显影单元块。

公开(公告)号：US20140327890A1

公开(公告)日：2014-11-06

申请号：US14332473

申请日：2014-07-16

Applicant: Tokyo Electron Limited

Inventor： Nobuaki MATSUOKA ,  Akira MIYATA ,  Shinichi HAYASHI ,  Suguru ENOKIDA

IPC: G03F7/30 ,  G03F7/16

CPC classification number: H01L21/67178 ,  G03F7/16 ,  G03F7/162 ,  G03F7/30 ,  G03F7/3021 ,  H01L21/67184 ,  H01L21/67225 ,  H01L21/6723

Abstract: In one embodiment, a coating and developing apparatus is provided with transfer units, provided between a stack of early-stage processing unit blocks and a stack of later-stage processing unit blocks to transfer a substrate between the transport mechanisms of laterally-adjacent unit blocks, and a vertically-movable auxiliary transfer mechanism for transporting a substrate between the transfer units. A stack of first developing unit blocks is stacked on the stack of early-stage processing unit blocks, and a stack of second developing unit blocks is stacked on the stack of later-stage processing unit blocks.

Abstract translation: 在一个实施例中，涂覆和显影装置设置有转移单元，其设置在一堆早期处理单元块和一堆后期处理单元块之间，用于在横向相邻单元块的传送机构之间传送基板 以及用于在转印单元之间输送基板的可垂直移动的辅助转印机构。 一堆第一显影单元块堆叠在早期处理单元块的堆叠上，并且第二显影单元块的堆叠堆叠在后级处理单元块的堆叠上。

公开(公告)号：US20240079256A1

公开(公告)日：2024-03-07

申请号：US18388550

申请日：2023-11-10

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

IPC: H01L21/677 ,  G03F7/16

CPC classification number: H01L21/67712 ,  G03F7/168 ,  H01L21/67766

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US20230017389A1

公开(公告)日：2023-01-19

申请号：US17864722

申请日：2022-07-14

Applicant: Tokyo Electron Limited

Inventor： Tatsuhiko TSUJIHASHI ,  Suguru ENOKIDA ,  Kazuki MATSUSHITA

IPC: B65G49/06 ,  B65G47/91

Abstract: A substrate transfer device includes a substrate holder and a base to which the substrate holder is movably attached. The substrate holder includes first and second suction holes provided to be open in a placing surface, first and second protrusions disposed respectively in the first and second suction holes, and first and second supports provided respectively in the vicinity of the first and second suction holes so as to protrude upward from the placing surface. The first protrusion is pressed by a first elastic member toward an upward direction to protrude from the first suction hole such that the first protrusion blocks the first suction hole, and the second protrusion is pressed by a second elastic member toward an upward direction to protrude from the second suction hole such that the second protrusion blocks the second suction hole.

公开(公告)号：US20160372346A1

公开(公告)日：2016-12-22

申请号：US15252374

申请日：2016-08-31

Applicant: Tokyo Electron Limited

Inventor： Masahiro NAKAHARADA ,  Yoji SAKATA ,  Akira MIYATA ,  Shinichi HAYASHI ,  Suguru ENOKIDA ,  Tsunenaga NAKASHIMA

IPC: H01L21/67 ,  G03F7/20

CPC classification number: H01L21/67051 ,  G03F7/70691 ,  H01L21/02043 ,  H01L21/67046 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67213 ,  H01L21/67225 ,  H01L21/67242 ,  H01L21/67248 ,  H01L21/67253 ,  H01L21/67706 ,  H01L21/67748 ,  H01L21/6875 ,  H01L22/20

Abstract: An interface station of a coating and developing treatment system has: a cleaning unit cleaning at least a rear surface of a wafer before the wafer is transferred into an exposure apparatus; an inspection unit inspecting the rear surface of the cleaned wafer whether the wafer is exposable, before it is transferred into the exposure apparatus; wafer transfer mechanisms including arms transferring the wafer between the units and a wafer transfer control part controlling operations of the wafer transfer mechanisms. When it is determined that a state of the wafer becomes an exposable state by re-cleaning in the cleaning unit as a result of the inspection, the wafer transfer control part controls the wafer transfer mechanisms to transfer the wafer again to the cleaning unit.