公开(公告)号：US20240079256A1

公开(公告)日：2024-03-07

申请号：US18388550

申请日：2023-11-10

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

IPC: H01L21/677 ,  G03F7/16

CPC classification number: H01L21/67712 ,  G03F7/168 ,  H01L21/67766

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US20250079215A1

公开(公告)日：2025-03-06

申请号：US18949607

申请日：2024-11-15

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

IPC: H01L21/677 ,  G03F7/16

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US20240036482A1

公开(公告)日：2024-02-01

申请号：US18355918

申请日：2023-07-20

Applicant: Tokyo Electron Limited

Inventor： Masashi TSUCHIYAMA ,  Taro YAMAMOTO

IPC: G03F7/00

CPC classification number: G03F7/7075

Abstract: A substrate treatment system includes: a wet system having a wet treatment apparatus which performs in a wet mode one of substrate treatments from a formation treatment of a resist film to a developing treatment of the resist film after exposure, and coupled to an exposure apparatus; a dry system having a dry treatment apparatus which performs in a dry mode a same kind of substrate treatment by the wet treatment apparatus; and a relay transfer system which transfers the substrate between the wet system and the dry system, wherein: when viewed from a coupling direction, the wet system is arranged such that the exposure apparatus projects from one side in a depth direction perpendicular to the coupling direction in top view; and the dry system is arranged to be adjacent to the one side of the wet system in the depth direction.

公开(公告)号：US20210103225A1

公开(公告)日：2021-04-08

申请号：US17030810

申请日：2020-09-24

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Hiroki SATO ,  Ippei HAMADA

IPC: G03F7/20 ,  G03F7/16

Abstract: An apparatus includes: a treatment block; and a relay block including a first transfer-in/out module for an exposure apparatus. In the treatment block, a treatment module is provided in each layer, and a deliverer is provided at an end on the relay block side in the layer including a pre-exposure treatment module. In the relay block, a second transfer-in/out module for the deliverer and a post-exposure treatment module is provided in a region adjacent, in the width direction, to the deliverer, the first transfer-in/out module is provided in a relay side transfer region extending in a depth direction from a region overlapping with the second transfer-in/out module, the post-exposure treatment module is provided in a region adjacent, in an up-down direction, to the relay side transfer region and adjacent, in the depth direction, to the second transfer-in/out module, and a relay mechanism is provided.

公开(公告)号：US20210103224A1

公开(公告)日：2021-04-08

申请号：US17030735

申请日：2020-09-24

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Hiroki SATO ,  Ippei HAMADA

IPC: G03F7/20 ,  G03F7/16

Abstract: An apparatus includes: a treatment block including treatment modules; and a relay block coupling the treatment block and an exposure apparatus in a width direction, and including a transfer-in/out mechanism for the exposure apparatus; and in the treatment block being multilayered in an up-down direction, a transfer mechanism is provided in a transfer region extending in the width direction, and in a layer, in the treatment block, at a position accessible from the transfer-in/out mechanism, a deliverer on which the substrate is mounted when the substrate is delivered between the blocks is provided at an end on the relay block side, pre-exposure storages storing the substrate before the exposure are provided along the width direction in two regions between which the transfer region is interposed in a depth direction, and a non-treatment unit is provided at a portion where the pre-exposure storages are not provided in the two regions.

公开(公告)号：US20220165597A1

公开(公告)日：2022-05-26

申请号：US17533672

申请日：2021-11-23

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

IPC: H01L21/677 ,  G03F7/16

Abstract: A substrate processing apparatus includes; a carrier block; a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block; a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks; a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks; a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block; and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US20220165596A1

公开(公告)日：2022-05-26

申请号：US17530581

申请日：2021-11-19

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi WATANABE ,  Masashi TSUCHIYAMA ,  Suguru ENOKIDA ,  Taro YAMAMOTO

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  G03F7/16

Abstract: A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.