- 专利标题： CO-PLANAR INTERCONNECTION MECHANISMS FOR CIRCUIT BOARDS
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申请号： US17671566申请日： 2022-02-14
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公开(公告)号： US20220174820A1公开(公告)日： 2022-06-02
- 发明人: Mooi Ling Chang , Tin Poay Chuah , Eng Huat Goh , Min Suet Lim , Twan Sing Loo
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H05K1/14
- IPC分类号： H05K1/14 ; G06F13/40 ; H05K1/18 ; H01R12/51 ; H05K1/11
摘要：
In one embodiment, a system includes a first circuit defining recesses along an edge of the first circuit board, and a second circuit board defining fins extending from at least one outer edge of the second circuit board. The fins of the second circuit board are positioned within the recesses of the second circuit board to connect the circuit boards in a co-planar manner. The fins and recesses may be shaped to provide an interlocking connection of the first and second circuit boards in the co-planar direction.
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