Invention Application
- Patent Title: Hybrid Decoupling Capacitor and Method Forming Same
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Application No.: US17655431Application Date: 2022-03-18
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Publication No.: US20220208957A1Publication Date: 2022-06-30
- Inventor: Hao-Chieh Chan , Chung-Hui Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L23/522 ; H01L21/8234 ; H01L27/088 ; H01L21/762 ; H01L29/78 ; H01L29/66 ; H01L27/08 ; H01L27/06 ; H01L29/94

Abstract:
A device includes a first capacitor and a second capacitor connected to the first capacitor in parallel. The first capacitor includes a semiconductor region and a first plurality of gate stacks. The first plurality of gate stacks comprise a plurality of gate dielectrics over and contacting the semiconductor region, and a plurality of gate electrodes over the plurality of gate dielectrics. The second capacitor includes an isolation region, a second plurality of gate stacks over the isolation region, and a plurality of conductive strips over the isolation region and parallel to the second plurality of gate stacks. The second plurality of gate stacks and the plurality of conductive strips are laid out alternatingly.
Information query
IPC分类: