Invention Application
- Patent Title: POLISHING COMPOSITION, METHOD FOR MANUFACTURING POLISHING COMPOSITION, AND POLISHING METHOD
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Application No.: US17568827Application Date: 2022-01-05
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Publication No.: US20220220339A1Publication Date: 2022-07-14
- Inventor: Daiki ITO , Toshio SHINODA
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu-shi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu-shi
- Priority: JP2021-002204 20210108
- Main IPC: C09G1/02
- IPC: C09G1/02 ; B24B37/04 ; C09K3/14
Abstract:
There are provided a polishing composition capable of improving the polishing removal rate of a TEOS film, a method for manufacturing the polishing composition, and a polishing method.
A polishing composition contains cationized colloidal silica chemically surface-modified with an amino silane coupling agent and an anionic surfactant, in which the pH value is larger than 3 and smaller than 6.
A polishing composition contains cationized colloidal silica chemically surface-modified with an amino silane coupling agent and an anionic surfactant, in which the pH value is larger than 3 and smaller than 6.
Public/Granted literature
- US1696616A Binding post Public/Granted day:1928-12-25
Information query
