Invention Application
- Patent Title: SETTING AN UPPER BOUND ON RRAM RESISTANCE
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Application No.: US17147401Application Date: 2021-01-12
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Publication No.: US20220223205A1Publication Date: 2022-07-14
- Inventor: Youngseok Kim , Soon-Cheon Seo , Choonghyun Lee , Injo Ok , Alexander Reznicek
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Main IPC: G11C13/00
- IPC: G11C13/00 ; H01L45/00

Abstract:
An electronic circuit includes a plurality of word lines; a plurality of bit lines intersecting the plurality of word lines at a plurality of grid points; and a plurality of resistive random-access memory cells located at the plurality of grid points. Each of the resistive random-access memory cells includes a top metal coupled to one of: a corresponding one of the word lines and a corresponding one of the bit lines; a bottom metal coupled to another one of: the corresponding one of the word lines and the corresponding one of the bit lines; a dielectric sandwiched between the top metal and the bottom metal; and a high-resistance semiconductive spacer electrically connecting the top metal and the bottom metal in parallel with the dielectric.
Public/Granted literature
- US11430514B2 Setting an upper bound on RRAM resistance Public/Granted day:2022-08-30
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