Invention Application
- Patent Title: SEMICONDUCTOR COMPONENT INCLUDING A DIELECTRIC LAYER
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Application No.: US17612677Application Date: 2020-06-23
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Publication No.: US20220231219A1Publication Date: 2022-07-21
- Inventor: Daniel Monteiro Diniz Reis , Daniel Pantel , Frank Schatz , Jochen Tomaschko , Mathias Mews , Timo Schary
- Applicant: Robert Bosch GmbH
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Priority: DE102019209964.5 20190705,DE102019209965.3 20190705,DE102019210032.5 20190708,DE102019210033.3 20190708
- International Application: PCT/EP2020/067567 WO 20200623
- Main IPC: H01L41/09
- IPC: H01L41/09 ; H01L41/316 ; H01L41/187 ; H01L41/047 ; H01L41/08

Abstract:
A semiconductor component that includes at least one dielectric layer and at least one first electrode and one second electrode. In addition, at least two defect types different from one another are present in the dielectric layer. These at least two defect types different from one another move along localized defect states, each at an average effective distance, in the direction of one of the two electrodes as a function of an operating voltage that is applied between the first electrode and the second electrode, and an operating temperature that is present. The average effective distance is greater than 3.2 nm.
Information query
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