Invention Application
- Patent Title: LAMINATE AND METHOD FOR PRODUCING SAME
-
Application No.: US17595570Application Date: 2020-07-09
-
Publication No.: US20220235468A1Publication Date: 2022-07-28
- Inventor: Akira FURUYA , Tadaaki KOJIMA , Hiroshi SUZUKI , Fumiaki NAKA
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Priority: JP2019-141027 20190731
- International Application: PCT/JP2020/026840 WO 20200709
- Main IPC: C23C28/00
- IPC: C23C28/00 ; C23C18/34 ; C23C18/44 ; C23C18/52 ; C23C18/54 ; C23C28/02 ; B32B15/01
Abstract:
A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.
Public/Granted literature
- US12031213B2 Laminate Public/Granted day:2024-07-09
Information query
IPC分类:
