公开(公告)号：US20220235468A1

公开(公告)日：2022-07-28

申请号：US17595570

申请日：2020-07-09

Applicant: SHOWA DENKO K.K.

Inventor： Akira FURUYA ,  Tadaaki KOJIMA ,  Hiroshi SUZUKI ,  Fumiaki NAKA

IPC: C23C28/00 ,  C23C18/34 ,  C23C18/44 ,  C23C18/52 ,  C23C18/54 ,  C23C28/02 ,  B32B15/01

Abstract: A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.

公开(公告)号：US20220227104A1

公开(公告)日：2022-07-21

申请号：US17614172

申请日：2020-08-11

Applicant: SHOWA DENKO K.K.

Inventor： Akira FURUYA ,  Tadaaki KOJIMA ,  Hiroshi SUZUKI ,  Fumiaki NAKA

IPC: B32B15/01 ,  C25D5/50 ,  C25D5/14

Abstract: A laminate including a metallic base material, a first nickel-containing plating film layer formed on the metallic base material, a gold plating film layer formed on the first nickel-containing plating film layer, a second nickel-containing plating film layer formed on the gold plating film layer, and a nickel fluoride film layer formed on the second nickel-containing plating film layer. Also disclosed is a method for producing the laminate as well as a constituent member of a semiconductor production device including the laminate.