Invention Grant
- Patent Title: Laminate
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Application No.: US17595570Application Date: 2020-07-09
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Publication No.: US12031213B2Publication Date: 2024-07-09
- Inventor: Akira Furuya , Tadaaki Kojima , Hiroshi Suzuki , Fumiaki Naka
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: Resonac Corporation
- Current Assignee: Resonac Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 19141027 2019.07.31
- International Application: PCT/JP2020/026840 2020.07.09
- International Announcement: WO2021/020064A 2021.02.04
- Date entered country: 2021-11-19
- Main IPC: B32B15/01
- IPC: B32B15/01 ; B32B3/10 ; B32B3/26 ; B32B3/30 ; B32B15/04 ; B32B15/18 ; B32B15/20 ; C23C8/12 ; C23C8/14 ; C23C18/16 ; C23C18/18 ; C23C18/32 ; C23C18/34 ; C23C18/36 ; C23C18/42 ; C23C18/44 ; C23C18/52 ; C23C18/54 ; C23C28/00 ; C23C28/02 ; C23C30/00 ; C25D3/12 ; H01J37/32 ; C22C38/44 ; C23C16/44
Abstract:
A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.
Public/Granted literature
- US20220235468A1 LAMINATE AND METHOD FOR PRODUCING SAME Public/Granted day:2022-07-28
Information query
