Invention Application
- Patent Title: BARE-DIE SMART BRIDGE CONNECTED WITH COPPER PILLARS FOR SYSTEM-IN-PACKAGE APPARATUS
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Application No.: US17716958Application Date: 2022-04-08
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Publication No.: US20220238440A1Publication Date: 2022-07-28
- Inventor: Georg SEIDEMANN , Thomas WAGNER , Adreas WOLTER , Bernd WAIDHAS
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L21/768 ; H01L23/48 ; H01L23/532 ; H01L23/00 ; H01L23/538 ; H01L25/16 ; H01L25/065 ; H01L21/56
Abstract:
A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.
Information query
IPC分类:
