公开(公告)号：US20220238440A1

公开(公告)日：2022-07-28

申请号：US17716958

申请日：2022-04-08

Applicant: Intel Corporation

Inventor： Georg SEIDEMANN ,  Thomas WAGNER ,  Adreas WOLTER ,  Bernd WAIDHAS

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/48 ,  H01L23/532 ,  H01L23/00 ,  H01L23/538 ,  H01L25/16 ,  H01L25/065 ,  H01L21/56

Abstract: A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.

公开(公告)号：US20220115323A1

公开(公告)日：2022-04-14

申请号：US17555219

申请日：2021-12-17

Applicant: Intel Corporation

Inventor： Georg SEIDEMANN ,  Thomas WAGNER ,  Adreas WOLTER ,  Bernd WAIDHAS

IPC: H01L23/528 ,  H01L21/768 ,  H01L23/48 ,  H01L23/532 ,  H01L23/00 ,  H01L23/538 ,  H01L25/16 ,  H01L25/065 ,  H01L21/56

Abstract: A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.