Invention Application
- Patent Title: THERMAL PROCESS CHAMBER LID WITH BACKSIDE PUMPING
-
Application No.: US17720836Application Date: 2022-04-14
-
Publication No.: US20220246471A1Publication Date: 2022-08-04
- Inventor: Anqing Cui , Dien-Yeh Wu , Wei V. Tang , Yixiong Yang , Bo Wang
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/768
- IPC: H01L21/768 ; C23C16/02 ; C23C16/455 ; C23C16/458 ; H01L21/285 ; H01L21/687 ; H01L23/532
Abstract:
Process chamber lid assemblies and process chambers comprising same are described. The lid assembly has a housing with a gas dispersion channel in fluid communication with a lid plate. A contoured bottom surface of the lid plate defines a gap to a top surface of a gas distribution plate. A pumping channel is formed between an upper outer peripheral contour of the gas distribution plate and the lid plate.
Public/Granted literature
- US11715667B2 Thermal process chamber lid with backside pumping Public/Granted day:2023-08-01
Information query
IPC分类:
