Invention Application
- Patent Title: GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING INSULATOR FIN ON INSULATOR SUBSTRATE
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Application No.: US17727603Application Date: 2022-04-22
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Publication No.: US20220246743A1Publication Date: 2022-08-04
- Inventor: Aaron D. LILAK , Rishabh MEHANDRU , Cory WEBER , Willy RACHMADY , Varun MISHRA
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L21/02 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/165 ; H01L29/66 ; H01L29/78 ; H01L29/786

Abstract:
Gate-all-around integrated circuit structures having an insulator fin on an insulator substrate, and methods of fabricating gate-all-around integrated circuit structures having an insulator fin on an insulator substrate, are described. For example, an integrated circuit structure includes an insulator fin on an insulator substrate. A vertical arrangement of horizontal semiconductor nanowires is over the insulator fin. A gate stack surrounds a channel region of the vertical arrangement of horizontal semiconductor nanowires, and the gate stack is overlying the insulator fin. A pair of epitaxial source or drain structures is at first and second ends of the vertical arrangement of horizontal semiconductor nanowires and at first and second ends of the insulator fin.
Public/Granted literature
- US11862702B2 Gate-all-around integrated circuit structures having insulator FIN on insulator substrate Public/Granted day:2024-01-02
Information query
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