Invention Application
- Patent Title: SEMICONDUCTOR DEVICE
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Application No.: US17200908Application Date: 2021-03-15
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Publication No.: US20220254888A1Publication Date: 2022-08-11
- Inventor: Yi-Chieh Wang , Po-Chun Lai , Ke-Feng Lin , Chen-An Kuo , Ze-Wei Jhou
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu City
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu City
- Priority: CN202110175890.X 20210209
- Main IPC: H01L29/40
- IPC: H01L29/40 ; H01L29/78 ; H01L27/088

Abstract:
A semiconductor device includes a semiconductor substrate, a gate structure, a source region, a drain region, and a plurality of field plates. The gate structure is disposed on the semiconductor substrate. The source region and the drain region are disposed in the semiconductor substrate and located at two opposite sides of the gate structure in a first direction respectively. The field plates are disposed on the semiconductor substrate. Each of the field plates is partly located above the gate structure and partly located between the gate structure and the drain region. The gate structure is electrically connected with at least one of the field plates, and the source region is electrically connected with at least one of the field plates.
Public/Granted literature
- US11462621B2 Semiconductor device Public/Granted day:2022-10-04
Information query
IPC分类: