Invention Application
- Patent Title: RESIN COMPOSITION, PREPREG, METHOD FOR MANUFACTURING PREPREG, LAMINATE, AND PRINTED WIRING BOARD
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Application No.: US17622119Application Date: 2020-06-19
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Publication No.: US20220259378A1Publication Date: 2022-08-18
- Inventor: Dai SASAKI , Yohsuke ISHIKAWA , Kazuki MATSUMURA , Yasunori NISHIGUCHI , Hiroki TAMIYA , Koji KISHINO
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Priority: JP2019-119109 20190626
- International Application: PCT/JP2020/024212 WO 20200619
- Main IPC: C08G65/38
- IPC: C08G65/38 ; C08K3/011 ; C08K9/04 ; C08J3/12 ; C08K3/013 ; C08K5/00 ; C08J5/24 ; H05K1/03
Abstract:
A resin composition contains: a modified polyphenylene ether compound (A) having, at one terminal, a group with an unsaturated double bond; a cross-linking agent (B) having a carbon-carbon double bond; a hindered amine-based polymerization inhibitor (C); and a solvent (D).
Information query
