Invention Application
- Patent Title: LIGHT-EMITTING DEVICE AND ELEMENT MOUNTING WIRING BOARD
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Application No.: US17736764Application Date: 2022-05-04
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Publication No.: US20220263003A1Publication Date: 2022-08-18
- Inventor: Atsushi KOJIMA , Kenji OZEKI , Chinami NAKAI
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2019-136676 20190725
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/00 ; H01L33/56 ; H01L33/48 ; H01L33/60

Abstract:
A light-emitting device includes: a light-emiting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.
Public/Granted literature
- US11791448B2 Light-emitting device and element mounting wiring board Public/Granted day:2023-10-17
Information query
IPC分类: