公开(公告)号：US20220199877A1

公开(公告)日：2022-06-23

申请号：US17551389

申请日：2021-12-15

Applicant: NICHIA CORPORATION

Inventor： Atsushi KOJIMA ,  Kenji OZEKI

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00

Abstract: A method of manufacturing a light-emitting device includes: a providing step including providing a plurality of light sources, each of the light sources having an upper surface including a light-emitting portion, a lower surface opposite to the upper surface, and lateral surfaces between the upper surface and the lower surface, wherein each of the light sources includes an external connection terminal at the lower surface, and wherein the plurality of light sources are ranked in terms of at least one of luminous flux or chromaticity; an extracting step including extracting a plurality of light sources in a desired rank from the plurality of light sources; and a bonding step including bonding the lateral surfaces of adjacent ones of the plurality of extracted light sources via a bonding member such that the upper surfaces and the lower surfaces of the light sources are exposed from the bonding member and such that the bonding member is spaced apart from the external connection terminals.

公开(公告)号：US20200013936A1

公开(公告)日：2020-01-09

申请号：US16506125

申请日：2019-07-09

Applicant: NICHIA CORPORATION

Inventor： Masato AIHARA ,  Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI ,  Kazuya TAMURA

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62 ,  H01L33/64

Abstract: A light emitting device includes: a light emitting element; a first reflecting member containing reflecting particles, and covering the upper surface of a base while exposing a light extraction surface of the light emitting element; a first cover member having a lower concentration of reflecting particles than the first reflecting member and covering the first reflecting member and a portion of lateral surfaces of the light emitting element while exposing the light extraction surface of the light emitting element; a second cover member covering a portion of the lateral surfaces of the light emitting element; a second reflecting member surrounding the second cover member in a top view and contacting the second cover member and the first reflecting member; the second reflecting member having a narrow-width portion being in contact with the first reflecting member and a wide-width portion located above the narrow-width portion in a cross-sectional view.

公开(公告)号：US20240210725A1

公开(公告)日：2024-06-27

申请号：US18390715

申请日：2023-12-20

Applicant: NICHIA CORPORATION

Inventor： Hajime AKIMOTO ,  Hiroshi MIYAIRI ,  Kazuhiro MIYAGI ,  Masakazu KOTANI ,  Keiko ONO ,  Atsushi KOJIMA

IPC: G02B30/56 ,  G06F3/01 ,  G06F3/042 ,  G06V10/74 ,  G06V40/10 ,  G09G3/00

CPC classification number: G02B30/56 ,  G06F3/013 ,  G06F3/042 ,  G06V10/74 ,  G06V40/10 ,  G09G3/003 ,  G02B5/124

Abstract: An image display device includes: a first display device configured to output a first image representing an operation part for an apparatus; an imaging element configured to reflect the first image and to form the first image in mid-air as a mid-air image; a first sensor configured to detect an approach of a detection object to the mid-air image and to output a first signal; and a controller configured to output a second signal to the apparatus based on the first signal.

公开(公告)号：US20230216000A1

公开(公告)日：2023-07-06

申请号：US18174703

申请日：2023-02-27

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L33/60 ,  H01L33/50 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L29/866 ,  H01L33/56 ,  H01L33/62 ,  H01L33/486 ,  H01L33/502 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.

公开(公告)号：US20230005895A1

公开(公告)日：2023-01-05

申请号：US17778000

申请日：2020-11-02

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Kosuke SATO ,  Chinami NAKAI ,  Takashi ISHII ,  Atsushi KOJIMA

IPC: H01L25/16 ,  H01L33/62 ,  H01L33/56 ,  H01L23/00

Abstract: A light emitting device and a light emitting module both having narrow spacing between emission faces, as well as a method of manufacturing light emitting device and a method of manufacturing light emitting module are provided.
A light emitting device 100 includes element structure bodies 15, at least one of the element structure bodies including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmitting member 30 disposed on the light emitting element 20, and a first cover member 50 covering the lateral faces of the light emitting element 20 on the submount substrate 10, and a second cover member 60 supporting the element structure bodies 15 by covering the lateral faces of the element structure bodies 15.

公开(公告)号：US20200295242A1

公开(公告)日：2020-09-17

申请号：US16817796

申请日：2020-03-13

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L33/52 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A method of producing a light-emitting device includes: providing a package having an upper surface and a recess including an opening located at the upper surface; disposing a light-emitting element on a surface defining a bottom of the recess of the package; disposing an uncured sealing member in the recess of the package; and curing the uncured sealing member while applying a centrifugal force to the package in which the uncured sealing member are disposed, such that the centrifugal force is applied in a direction perpendicular to the upper surface and toward the surface defining the bottom of the recess.

公开(公告)号：US20200006608A1

公开(公告)日：2020-01-02

申请号：US16455620

申请日：2019-06-27

Applicant: Nichia Corporation

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device includes: mounting a light emitting element in a package in which a recess is defined, the light emitting element being mounted on a bottom surface defining the recess; forming a first reflecting layer by covering lateral surfaces defining the recess with a first resin containing a first reflecting material; forming a second reflecting layer covering the bottom surface defining the recess, wherein the step of forming the second reflecting layer comprises settling the second reflecting material in the second resin by a centrifugal force so as to form (i) a layer containing a second reflecting material on the bottom surface defining the recess, and (ii) a light-transmissive layer above the layer containing the second reflecting material; and disposing a phosphor-containing layer on the second reflecting layer and the light emitting element, the phosphor-containing layer comprising a third resin that contains a phosphor.

公开(公告)号：US20220263003A1

公开(公告)日：2022-08-18

申请号：US17736764

申请日：2022-05-04

Applicant: NICHIA CORPORATION

Inventor： Atsushi KOJIMA ,  Kenji OZEKI ,  Chinami NAKAI

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/56 ,  H01L33/48 ,  H01L33/60

Abstract: A light-emitting device includes: a light-emiting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.

公开(公告)号：US20220029061A1

公开(公告)日：2022-01-27

申请号：US17495280

申请日：2021-10-06

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI ,  Yoshio ICHIHARA

IPC: H01L33/44 ,  H01L33/56 ,  H01L33/60 ,  H01L33/54

Abstract: A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member located over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.

公开(公告)号：US20200212277A1

公开(公告)日：2020-07-02

申请号：US16726394

申请日：2019-12-24

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: A light emitting device includes: a substrate including a grooved part surrounding a first region; a light emitting element mounted in the first region; a first cover member comprising: a reflecting material-containing layer that is disposed in the groove of the grooved part and that contains a first reflecting material, and a light transmitting layer that covers at least a portion of lateral surfaces of the light emitting element; and a light transmitting member disposed on the first cover member and the light emitting element