公开(公告)号：US20200013936A1

公开(公告)日：2020-01-09

申请号：US16506125

申请日：2019-07-09

Applicant: NICHIA CORPORATION

Inventor： Masato AIHARA ,  Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI ,  Kazuya TAMURA

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62 ,  H01L33/64

Abstract: A light emitting device includes: a light emitting element; a first reflecting member containing reflecting particles, and covering the upper surface of a base while exposing a light extraction surface of the light emitting element; a first cover member having a lower concentration of reflecting particles than the first reflecting member and covering the first reflecting member and a portion of lateral surfaces of the light emitting element while exposing the light extraction surface of the light emitting element; a second cover member covering a portion of the lateral surfaces of the light emitting element; a second reflecting member surrounding the second cover member in a top view and contacting the second cover member and the first reflecting member; the second reflecting member having a narrow-width portion being in contact with the first reflecting member and a wide-width portion located above the narrow-width portion in a cross-sectional view.

公开(公告)号：US20230216000A1

公开(公告)日：2023-07-06

申请号：US18174703

申请日：2023-02-27

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L33/60 ,  H01L33/50 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L25/167 ,  H01L29/866 ,  H01L33/56 ,  H01L33/62 ,  H01L33/486 ,  H01L33/502 ,  H01L2933/005 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A light emitting device includes: a substrate; a package having an upward-facing surface and an inward-facing surface that define a recess; a light emitting element mounted on the upward-facing surface of the package; a first cover member including: a light transmitting layer that contacts at least a portion of a lateral surface of the light emitting element, the light transmitting layer having an upper surface that is inclined from the lateral surface of the light emitting element towards the upward-facing surface of the package, and a reflecting material-containing layer located below the light-transmitting layer; and a second cover member that contacts the inward-facing surface of the package and is separated from the light emitting element.

公开(公告)号：US20230005895A1

公开(公告)日：2023-01-05

申请号：US17778000

申请日：2020-11-02

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Kosuke SATO ,  Chinami NAKAI ,  Takashi ISHII ,  Atsushi KOJIMA

IPC: H01L25/16 ,  H01L33/62 ,  H01L33/56 ,  H01L23/00

Abstract: A light emitting device and a light emitting module both having narrow spacing between emission faces, as well as a method of manufacturing light emitting device and a method of manufacturing light emitting module are provided.
A light emitting device 100 includes element structure bodies 15, at least one of the element structure bodies including a submount substrate 10, a light emitting element 20 disposed on the submount substrate 10, a light transmitting member 30 disposed on the light emitting element 20, and a first cover member 50 covering the lateral faces of the light emitting element 20 on the submount substrate 10, and a second cover member 60 supporting the element structure bodies 15 by covering the lateral faces of the element structure bodies 15.

公开(公告)号：US20200295242A1

公开(公告)日：2020-09-17

申请号：US16817796

申请日：2020-03-13

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L33/52 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A method of producing a light-emitting device includes: providing a package having an upper surface and a recess including an opening located at the upper surface; disposing a light-emitting element on a surface defining a bottom of the recess of the package; disposing an uncured sealing member in the recess of the package; and curing the uncured sealing member while applying a centrifugal force to the package in which the uncured sealing member are disposed, such that the centrifugal force is applied in a direction perpendicular to the upper surface and toward the surface defining the bottom of the recess.

公开(公告)号：US20200006608A1

公开(公告)日：2020-01-02

申请号：US16455620

申请日：2019-06-27

Applicant: Nichia Corporation

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56

Abstract: A method of manufacturing a light emitting device includes: mounting a light emitting element in a package in which a recess is defined, the light emitting element being mounted on a bottom surface defining the recess; forming a first reflecting layer by covering lateral surfaces defining the recess with a first resin containing a first reflecting material; forming a second reflecting layer covering the bottom surface defining the recess, wherein the step of forming the second reflecting layer comprises settling the second reflecting material in the second resin by a centrifugal force so as to form (i) a layer containing a second reflecting material on the bottom surface defining the recess, and (ii) a light-transmissive layer above the layer containing the second reflecting material; and disposing a phosphor-containing layer on the second reflecting layer and the light emitting element, the phosphor-containing layer comprising a third resin that contains a phosphor.

公开(公告)号：US20220263003A1

公开(公告)日：2022-08-18

申请号：US17736764

申请日：2022-05-04

Applicant: NICHIA CORPORATION

Inventor： Atsushi KOJIMA ,  Kenji OZEKI ,  Chinami NAKAI

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/56 ,  H01L33/48 ,  H01L33/60

Abstract: A light-emitting device includes: a light-emiting element; a wiring board that includes: a substrate, and a wiring pattern including: a plating base layer disposed on the substrate so as to have a gap portion that surrounds a first region in which the light-emitting element is mounted, and a plating layer having a groove that surrounds the first region; a first covering member, at least a portion of which is located in the groove and includes: a reflective material containing layer that contains a first reflective material, and a light-transmissive layer formed above the reflective material containing layer; and a light-transmissive member disposed on the first covering member and the light-emitting element.

公开(公告)号：US20220029061A1

公开(公告)日：2022-01-27

申请号：US17495280

申请日：2021-10-06

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI ,  Yoshio ICHIHARA

IPC: H01L33/44 ,  H01L33/56 ,  H01L33/60 ,  H01L33/54

Abstract: A light-emitting device includes: a mounting board; at least one light-emitting element located on or above the mounting board; a first covering member comprising, in order from an upper surface of the mounting board: a containing layer comprising a light-absorbing material, and a light-transmissive layer; and a second covering member located over the first covering member and the light-emitting element. A thickness of the containing layer is less than a thickness of the light-emitting element.

公开(公告)号：US20200212277A1

公开(公告)日：2020-07-02

申请号：US16726394

申请日：2019-12-24

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L33/60 ,  H01L25/16 ,  H01L29/866 ,  H01L33/48 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: A light emitting device includes: a substrate including a grooved part surrounding a first region; a light emitting element mounted in the first region; a first cover member comprising: a reflecting material-containing layer that is disposed in the groove of the grooved part and that contains a first reflecting material, and a light transmitting layer that covers at least a portion of lateral surfaces of the light emitting element; and a light transmitting member disposed on the first cover member and the light emitting element

公开(公告)号：US20200212015A1

公开(公告)日：2020-07-02

申请号：US16724007

申请日：2019-12-20

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L25/075

Abstract: A light emitting device includes: a plurality of light emitting elements; a plurality of light transmissive members, each located on an upper surface of a respective one of the light emitting element; a mounting board on which the light emitting elements are disposed; a first cover member located on or above the mounting board, the first cover member comprising: a first reflective material containing layer disposed between the light emitting elements and containing a first reflective material, and a light transmissive layer disposed between the light transmissive members; and a second cover member disposed around the light emitting elements and comprising a second reflective material.

公开(公告)号：US20240266480A1

公开(公告)日：2024-08-08

申请号：US18639648

申请日：2024-04-18

Applicant: NICHIA CORPORATION

Inventor： Kenji OZEKI ,  Atsushi KOJIMA ,  Chinami NAKAI

IPC: H01L33/52 ,  H01L33/00 ,  H01L33/50 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/52 ,  H01L33/005 ,  H01L33/502 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/005

Abstract: A light-emitting device includes: a package having an upper surface and defining a recess including an opening located at the upper surface; a light-emitting element disposed on a surface that defines a bottom of the recess of the package; and a sealing member disposed in the recess of the package and covering the light-emitting element. The upper surface of the sealing member includes a flat region. The flat region includes at least a region located above the light-emitting element. The flat region is located below the upper surface of the package.