Invention Application
- Patent Title: MOVEABLE EDGE RINGS WITH REDUCED CAPACITANCE VARIATION FOR SUBSTRATE PROCESSING SYSTEMS
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Application No.: US17671211Application Date: 2022-02-14
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Publication No.: US20220270863A1Publication Date: 2022-08-25
- Inventor: Christopher Kimball , Hema Swaroop Mopidevi , Saravanapriyan Sriraman , Tom A. Kamp , Darrell Ehrlich , Anthony Contreras , Chiara Helena Catherina Giammanco Macpherson
- Applicant: LAM RESEARCH CORPORATION
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/687
Abstract:
A moveable edge ring system for a plasma processing system includes a top edge ring and a first edge ring arranged below the top edge ring. A second edge ring is made of conductive material and includes an upper portion, a middle portion and a lower portion. The top edge ring and the second edge ring are configured to move in a vertical direction relative to a substrate support and the first edge ring when biased upwardly by a lift pin. The second edge ring is arranged below the top edge ring and radially outside of the first edge ring.
Information query
