公开(公告)号：US11798789B2

公开(公告)日：2023-10-24

申请号：US16960818

申请日：2018-09-10

Applicant: LAM RESEARCH CORPORATION

Inventor： Alejandro Sanchez ,  Grayson Ford ,  Darrell Ehrlich ,  Aravind Alwan ,  Kevin Leung ,  Anthony Contreras ,  Zhumin Han ,  Raphael Casaes ,  Joanna Wu

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01J37/32642 ,  H01J37/32715 ,  H01L21/67069 ,  H01L21/68735 ,  H01L21/68742 ,  H01J2237/20235

Abstract: A first edge ring for a substrate support is provided. The first edge ring includes an annular-shaped body and one or more lift pin receiving elements. The annular-shaped body is sized and shaped to surround an upper portion of the substrate support. The annular-shaped body defines an upper surface, a lower surface, a radially inner surface, and a radially outer surface. The one or more lift pin receiving elements are disposed along the lower surface of the annular-shaped body and sized and shaped to receive and provide kinematic coupling with top ends respectively of three or more lift pins.

公开(公告)号：US11594400B2

公开(公告)日：2023-02-28

申请号：US16845723

申请日：2020-04-10

Applicant: Lam Research Corporation

Inventor： Ryan Bise ,  Rajinder Dhindsa ,  Alexei Marakhtanov ,  Lumin Li ,  Sang Ki Nam ,  Jim Rogers ,  Eric Hudson ,  Gerardo Delgadino ,  Andrew D. Bailey, III ,  Mike Kellogg ,  Anthony de la Llera ,  Darrell Ehrlich

IPC: H01J37/32 ,  H01L21/67

Abstract: A plasma processing system includes a plasma chamber having a substrate support, and a multi-zone gas injection upper electrode disposed opposite the substrate support. An inner plasma region is defined between the upper electrode and the substrate support. The multi-zone gas injection upper electrode has a plurality of concentric gas injection zones. A confinement structure, which surrounds the inner plasma region, has an upper horizontal wall that interfaces with the outer electrode of the upper electrode. The confinement structure has a lower horizontal wall that interfaces with the substrate support, and includes a perforated confinement ring and a vertical wall that extends from the upper horizontal wall to the lower horizontal wall. The lower surface of the upper horizontal wall, an inner surface of the vertical wall, and an upper surface of the lower horizontal wall define a boundary of an outer plasma region, which surrounds the inner plasma region.

公开(公告)号：US20190148190A1

公开(公告)日：2019-05-16

申请号：US16247509

申请日：2019-01-14

Applicant: Lam Research Corporation

Inventor： Eric Pape ,  Darrell Ehrlich ,  Mike Jing

IPC: H01L21/67 ,  G01K1/14 ,  G01K1/02 ,  H01L21/683 ,  G01K7/00 ,  H01L21/673

Abstract: A substrate holder includes a base plate, a bond layer disposed over the base plate, and a ceramic layer disposed over the bond layer. The ceramic layer has a top surface including an area configured to support a substrate. A number of temperature measurement electrical devices are attached to the ceramic layer. Electrically conductive traces are embedded within the ceramic layer and positioned and routed to electrically connect with one or more of electrical contacts of the number of temperature measurement electrical devices. Electrical wires are disposed to electrically contact the electrically conductive traces. The electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.

公开(公告)号：US20240038504A1

公开(公告)日：2024-02-01

申请号：US18377141

申请日：2023-10-05

Applicant: Lam Research Corporation

Inventor： Alejandro SANCHEZ ,  Grayson Ford ,  Darrell Ehrlich ,  Aravind Alwan ,  Kevin Leung ,  Anthony Contreras ,  Zhumin Han ,  Raphael Casaes ,  Joanna Wu

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01J37/32642 ,  H01J37/32715 ,  H01L21/67069 ,  H01L21/68735 ,  H01L21/68742 ,  H01J2237/20235

Abstract: A first edge ring for a substrate support is provided. The first edge ring includes an annular-shaped body and one or more lift pin receiving elements. The annular-shaped body is sized and shaped to surround an upper portion of the substrate support. The annular-shaped body defines an upper surface, a lower surface, a radially inner surface, and a radially outer surface. The one or more lift pin receiving elements are disposed along the lower surface of the annular-shaped body and sized and shaped to receive and provide kinematic coupling with top ends respectively of three or more lift pins.

公开(公告)号：US10978323B2

公开(公告)日：2021-04-13

申请号：US16247509

申请日：2019-01-14

Applicant: Lam Research Corporation

Inventor： Eric Pape ,  Darrell Ehrlich ,  Mike Jing

IPC: G01K7/00 ,  G01K1/14 ,  H01L21/67 ,  H01L21/683 ,  G01K1/02 ,  H01L21/673

Abstract: A substrate holder includes a base plate, a bond layer disposed over the base plate, and a ceramic layer disposed over the bond layer. The ceramic layer has a top surface including an area configured to support a substrate. A number of temperature measurement electrical devices are attached to the ceramic layer. Electrically conductive traces are embedded within the ceramic layer and positioned and routed to electrically connect with one or more of electrical contacts of the number of temperature measurement electrical devices. Electrical wires are disposed to electrically contact the electrically conductive traces. The electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.

公开(公告)号：US10186437B2

公开(公告)日：2019-01-22

申请号：US14874991

申请日：2015-10-05

Applicant: Lam Research Corporation

Inventor： Eric Pape ,  Darrell Ehrlich ,  Mike Jing

IPC: H01L21/67 ,  G01K7/00 ,  H01L21/673 ,  H01L21/683 ,  G01K1/02 ,  G01K1/14

Abstract: A substrate holder includes a base plate, a bond layer disposed over the base plate, and a ceramic layer disposed over the bond layer. The ceramic layer has a top surface including an area configured to support a substrate. A number of temperature measurement electrical devices are attached to the ceramic layer. Electrically conductive traces are embedded within the ceramic layer and positioned and routed to electrically connect with one or more of electrical contacts of the number of temperature measurement electrical devices. Electrical wires are disposed to electrically contact the electrically conductive traces. The electrical wires extend from the ceramic layer through the bond layer and through the base plate to a control circuit.

公开(公告)号：US12131890B2

公开(公告)日：2024-10-29

申请号：US17435340

申请日：2020-03-04

Applicant: Lam Research Corporation

Inventor： Ann Erickson ,  Darrell Ehrlich

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32724 ,  H01J37/32642 ,  H01L21/6833 ,  H01J37/32082 ,  H01J2237/2007 ,  H01J2237/334

Abstract: An electrostatic chuck system for a plasma processing chamber is provided. A base plate comprising Al—SiC is provided. A ceramic plate is disposed over the base plate. A bonding layer bonds the ceramic plate to the base plate.

公开(公告)号：US10332729B2

公开(公告)日：2019-06-25

申请号：US15895367

申请日：2018-02-13

Applicant: LAM RESEARCH CORPORATION

Inventor： Darrell Ehrlich ,  Daniel Arthur Brown ,  Ian Kenworthy

IPC: H01J37/32 ,  H01L21/3065 ,  C23C16/455

Abstract: A compression member for use in a showerhead electrode assembly of a capacitively coupled plasma chamber. The member applies a compression force to a portion of a film heater adjacent a power supply boot on an upper surface of a thermal control plate and is located between the thermal control plate and a temperature-controlled top plate. The member is composed of an electrically insulating elastomeric material which can work over a large range of compressions and temperatures.

公开(公告)号：US20190187003A1

公开(公告)日：2019-06-20

申请号：US15842763

申请日：2017-12-14

Applicant: Lam Research Corporation

Inventor： Justin Brunnett ,  Shawn Tokairin ,  Shijian Li ,  Darrell Ehrlich

IPC: G01K1/10 ,  H01J37/32

CPC classification number: G01K1/10 ,  G01K7/02 ,  G01K7/22 ,  G01K11/20 ,  H01J37/32477 ,  H01J37/32935

Abstract: A temperature sensor probe having a shaft is described. The shaft is made from a material that is corrosion resistant to plasma and remnants of a plasma process. The shaft extends over a portion of a metal layer, which forms a tip of the temperature sensor probe. The shaft further extends over a sleeve of the temperature sensor probe, a portion of a fiber optic medium of the temperature sensor probe and a portion of the fiber bundle housing of the temperature sensor probe. The material of the shaft increases a number of active processing hours for which the shaft is used within a plasma chamber during the plasma process.

公开(公告)号：US20170332480A1

公开(公告)日：2017-11-16

申请号：US15586178

申请日：2017-05-03

Applicant: LAM RESEARCH CORPORATION

Inventor： Yuma Ohkura ,  Darrell Ehrlich ,  Eric A. Pape

IPC: H05K1/02 ,  H05K1/03 ,  H05B3/26 ,  H05K1/11 ,  H05K1/09

Abstract: A substrate support for a substrate processing system includes a plurality of heating zones, a baseplate, at least one of a heating layer and a ceramic layer arranged on the baseplate, and a plurality of heating elements provided within the at least one of the heating layer and the ceramic layer. The plurality of heating elements includes a first material having a first electrical resistance. Wiring is provided through the baseplate in a first zone of the plurality of heating zones. An electrical connection is routed from the wiring in the first zone to a first heating element of the plurality of heating elements. The first heating element is arranged in a second zone of the plurality of heating zones and the electrical connection includes a second material having a second electrical resistance that is less than the first electrical resistance.