Invention Application
- Patent Title: STIMULUS RESPONSIVE POLYMER FILMS AND FORMULATIONS
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Application No.: US17639850Application Date: 2020-09-01
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Publication No.: US20220301859A1Publication Date: 2022-09-22
- Inventor: Gregory BLACHUT , Diane HYMES , Stephen M. SIRARD
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- International Application: PCT/US2020/070483 WO 20200901
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L23/31 ; C09D5/26 ; C09D7/63 ; B05D1/00 ; C23C16/40 ; C23C16/34
Abstract:
Formulations for forming stimulus responsive polymers (SRPs) on semiconductor substrates include organic weak acids. Methods of protecting sensitive substrates including forming an SRP layer on sensitive substrates and forming one or more cap layers on the SRP layer.
Public/Granted literature
- US2616465A Extensible hack saw frame Public/Granted day:1952-11-04
Information query
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