公开(公告)号：US20230136036A1

公开(公告)日：2023-05-04

申请号：US17998489

申请日：2021-05-10

Applicant: Lam Research Corporation

Inventor： Stephen M. SIRARD ,  Gregory BLACHUT ,  Diane HYMES

IPC: H01L21/311

Abstract: Removing a stimuli responsive polymer (SRP) from a substrate includes controlled degradation. In certain embodiments of the methods described herein, removing SRPs includes exposure to two reactants that react to form an acid or base that can trigger the degradation of the SRP. The exposure occurs sequentially to provide more precise top down control. In some embodiments, the methods involve diffusing a compound, or a reactant that reacts to form a compound, only to a top portion of the SRP. The top portion is then degraded and removed, leaving the remaining SRP intact. The exposure and removal cycles are repeated.

公开(公告)号：US20240312778A1

公开(公告)日：2024-09-19

申请号：US18044336

申请日：2021-09-09

Applicant: Lam Research Corporation

Inventor： Stephen J. BANIK, II ,  Bryan L. BUCKALEW ,  Stephen M. SIRARD ,  Gregory BLACHUT ,  Ratchana LIMARY ,  Diane HYMES ,  Justin OBERST ,  Priyanka SURESH

IPC: H01L21/02 ,  G03F7/00

CPC classification number: H01L21/02334 ,  G03F7/70008 ,  H01L21/02277 ,  H01L21/0228

Abstract: The present disclosure relates to use of a stimulus responsive polymer (SRP) as a capping material during direct metal-metal binding. Processes and layers employing an SRP are described herein.

公开(公告)号：US20230295412A1

公开(公告)日：2023-09-21

申请号：US18006552

申请日：2021-07-23

Applicant: Lam Research Corporation

Inventor： Stephen M. SIRARD ,  Gregory BLACHUT ,  Ratchana LIMARY ,  Diane HYMES ,  Yang PAN

IPC: C08L61/18 ,  B05D1/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/29

CPC classification number: C08L61/18 ,  B05D1/005 ,  H01L21/56 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/293 ,  C08L2203/162 ,  C08L2203/206

Abstract: The present disclosure relates to a stimulus responsive polymer (SRP) that includes a homopolymer. Methods, films, and formulations employing an SRP are also described herein.

公开(公告)号：US20240429040A1

公开(公告)日：2024-12-26

申请号：US18826414

申请日：2024-09-06

Applicant: Lam Research Corporation

Inventor： Stephen M. SIRARD ,  Ratchana LIMARY ,  Yang PAN ,  Diane HYMES

IPC: H01L21/02 ,  H01L21/306 ,  H01L21/67

Abstract: A method for protecting a surface of a substrate during processing includes a) providing a solution forming a co-polymer having a ceiling temperature; b) dispensing the solution onto a surface of the substrate to form a sacrificial protective layer, wherein the co-polymer is kinetically trapped to allow storage at a temperature above the ceiling temperature; c) exposing the substrate to ambient conditions for a predetermined period; and d) de-polymerizing the sacrificial protective layer by using stimuli selected from a group consisting of ultraviolet (UV) light and heat.

公开(公告)号：US20230207305A1

公开(公告)日：2023-06-29

申请号：US17998479

申请日：2021-05-10

Applicant: Lam Research Corporation

Inventor： Stephen M. SIRARD ,  Gregory BLACHUT ,  Diane HYMES

IPC: H01L21/02 ,  H01J37/32 ,  B08B7/00 ,  B08B7/04

CPC classification number: H01L21/02057 ,  H01J37/32357 ,  H01J37/32422 ,  B08B7/0035 ,  B08B7/0071 ,  B08B7/04 ,  B08B2220/04

Abstract: Removing stimulus responsive polymers (SRPs) includes exposure to high energy metastable species, generated in a noble gas plasma, at an elevated temperature. The metastable species have sufficient energies and lifetimes to scission bonds on the polymer or other residues. At temperatures greater than the ceiling temperature of the SRP, there is a strong thermodynamic driving force to revert to volatile monomers once bond scissioning has occurred. The metastable species are not chemically reactive and do not appreciably affect the underlying surface. The high energy metastable species are effective at removing residues that remain after exposure to other stimuli such as heat.

公开(公告)号：US20220328338A1

公开(公告)日：2022-10-13

申请号：US17639869

申请日：2020-09-01

Applicant: Lam Research Corporation ,  The Regents of the University of California

Inventor： Gregory BLACHUT ,  Diane HYMES ,  Stephen M. SIRARD ,  Ratchana LIMARY ,  Christopher M. Bates

IPC: H01L21/683

Abstract: The present disclosure relates to methods of forming a film including small molecules. Such methods can optionally include removing such small molecules, such as by way of sublimation, evaporation, or conversion to a more volatile form.

公开(公告)号：US20220301859A1

公开(公告)日：2022-09-22

申请号：US17639850

申请日：2020-09-01

Applicant: Lam Research Corporation

Inventor： Gregory BLACHUT ,  Diane HYMES ,  Stephen M. SIRARD

IPC: H01L21/02 ,  H01L23/31 ,  C09D5/26 ,  C09D7/63 ,  B05D1/00 ,  C23C16/40 ,  C23C16/34

Abstract: Formulations for forming stimulus responsive polymers (SRPs) on semiconductor substrates include organic weak acids. Methods of protecting sensitive substrates including forming an SRP layer on sensitive substrates and forming one or more cap layers on the SRP layer.

公开(公告)号：US20140373384A1

公开(公告)日：2014-12-25

申请号：US13924314

申请日：2013-06-21

Applicant: Lam Research Corporation

Inventor： Stephen M. SIRARD ,  Diane HYMES ,  Olivier B. POSTEL

IPC: H01L21/02

CPC classification number: H01L21/02057 ,  H01L21/02082 ,  H01L21/67034

Abstract: A method, for drying an etched layer with a plurality of structures with etched spaces between the plurality of structures is provided. A liquid is provided within the spaces on the etched layer. The liquid is displaced with a drying solution with a solvent. Some of the solvent is removed from the drying solution to form a solid from the solution, wherein the solid at least fill half the height of the etched high aspect ratio spaces. The solid is removed.

Abstract translation: 提供一种用于在多个结构之间用具有蚀刻空间的多个结构干燥蚀刻层的方法。 在蚀刻层上的空间内提供液体。 用溶剂用干燥溶液置换液体。 将一些溶剂从干燥溶液中除去，以从溶液中形成固体，其中固体至少填充被蚀刻的高纵横比空间的一半高度。 固体被去除。

公开(公告)号：US20140179097A1

公开(公告)日：2014-06-26

申请号：US13725853

申请日：2012-12-21

Applicant: LAM RESEARCH CORPORATION

Inventor： Diane J. HYMES ,  Stephen M. SIRARD

IPC: H01L21/768

CPC classification number: H01L21/76877 ,  H01L21/288 ,  H01L21/76837

Abstract: A method for filling features in a layer over a substrate is provided. A dispersion of nanoparticles less than 5 nm is placed on the layer. The liquid is frozen by lowering a temperature of the liquid. The frozen liquid is sublimated by decreasing pressure and subsequently heating the frozen liquid, wherein the nanoparticles are not sublimated.

Abstract translation: 提供了一种用于在衬底上填充层中的特征的方法。 小于5nm的纳米颗粒的分散体置于该层上。 通过降低液体的温度来冷冻液体。 冷冻液体通过降低压力升华并随后加热冷冻液体，其中纳米颗粒不升华。

公开(公告)号：US20140101964A1

公开(公告)日：2014-04-17

申请号：US13650044

申请日：2012-10-11

Applicant: LAM RESEARCH CORPORATION

Inventor： Stephen M. SIRARD ,  Diane HYMES ,  Alan M. SCHOEPP ,  Ratchana LIMARY

IPC: F26B13/30 ,  F26B5/06 ,  F25B21/02

CPC classification number: H01L21/67034 ,  H01L21/02057 ,  H01L21/6831

Abstract: An apparatus for delamination drying a substrate is provided. A chamber for receiving a substrate is provided. A chuck supports and clamps the substrate within the chamber. A temperature controller controls the temperature of the substrate and is able to cool the substrate. A vacuum pump is in fluid connection with the chamber. A tilting mechanism is able to tilt the chuck at least 90 degrees.

Abstract translation: 提供了一种用于分层干燥基板的设备。 提供了用于接收基板的室。 卡盘支撑并夹紧腔室内的基底。 温度控制器控制衬底的温度并能够冷却衬底。 真空泵与腔室流体连接。 倾斜机构能够将卡盘倾斜至少90度。