Invention Application
- Patent Title: METHODS TO DICE OPTICAL DEVICES WITH OPTIMIZATION OF LASER PULSE SPATIAL DISTRIBUTION
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Application No.: US17655629Application Date: 2022-03-21
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Publication No.: US20220305588A1Publication Date: 2022-09-29
- Inventor: Wei-Sheng LEI , Mahendran Chidambaram , Kangkang Wang , Ludovic Godet , Visweswaren Sivaramakrishnan
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: B23K26/364
- IPC: B23K26/364 ; B23K26/40 ; B23K26/38
Abstract:
Embodiments of the present disclosure relate to methods for dicing one or more optical devices from a substrate with a laser machining system. The laser machining system utilizes a laser to perform methods for dicing one or more optical devices from a substrate along a dicing path. The methods use one of forming a plurality of laser spots along the dicing path or forming a plurality of trenches along the dicing path.
Information query
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