- 专利标题: PROCESSING APPARATUS AND FILM FORMING METHOD
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申请号: US17636808申请日: 2020-08-07
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公开(公告)号: US20220316065A1公开(公告)日: 2022-10-06
- 发明人: Makoto WADA , Takashi MATSUMOTO , Masahito SUGIURA , Ryota IFUKU , Hirokazu UEDA
- 申请人: TOKYO ELECTRON LIMITED
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2019-150865 20190821
- 国际申请: PCT/JP2020/030346 WO 20200807
- 主分类号: C23C16/511
- IPC分类号: C23C16/511 ; H01J37/32 ; C23C16/27 ; C23C16/455
摘要:
There is provided a processing apparatus for forming a film with a plasma. The processing apparatus comprises: a processing container, having a ceramic sprayed coating on an inner wall on which an antenna that radiates microwaves is arranged, configured to accommodate a substrate; a mounting table configured to mount the substrate in the processing container; and a controller configured to perform a precoating process of coating a surface of the ceramic sprayed coating with a first carbon film with a plasma of a first carbon-containing gas at a first pressure and a film forming process of forming a second carbon film on the substrate with a plasma of a second carbon-containing gas at a second pressure.
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