- 专利标题: FILM FORMATION METHOD
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申请号: US17753490申请日: 2020-08-24
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公开(公告)号: US20220336205A1公开(公告)日: 2022-10-20
- 发明人: Kenji OUCHI , Shuji AZUMO , Yumiko KAWANO , Shinichi IKE
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Minato-ku, Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Minato-ku, Tokyo
- 优先权: JP2019-162078 20190905,JP2020-092874 20200528
- 国际申请: PCT/JP2020/031752 WO 20200824
- 主分类号: H01L21/02
- IPC分类号: H01L21/02 ; C23C16/455 ; C23C16/56 ; C23C16/40 ; C23C16/06
摘要:
A film formation method for selectively forming a film on a substrate includes: a preparation step of preparing a substrate having a surface on which a first film and a second film are exposed; a first film forming step of supplying a compound for forming a self-assembled monolayer onto the substrate to form the self-assembled monolayer on the first film, the compound having a functional group including fluorine and carbon and suppressing formation of a third film; a second film forming step of forming the third film on the second film; and a first removal step of removing the third film formed in a vicinity of the self-assembled monolayer by irradiating the surface of the substrate with ions or active species, wherein the third film is a film which forms a volatile compound more easily than the first film by being bonded to fluorine and carbon in the self-assembled monolayer.
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