Invention Application
- Patent Title: FILM FORMATION METHOD
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Application No.: US17753490Application Date: 2020-08-24
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Publication No.: US20220336205A1Publication Date: 2022-10-20
- Inventor: Kenji OUCHI , Shuji AZUMO , Yumiko KAWANO , Shinichi IKE
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Minato-ku, Tokyo
- Priority: JP2019-162078 20190905,JP2020-092874 20200528
- International Application: PCT/JP2020/031752 WO 20200824
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/455 ; C23C16/56 ; C23C16/40 ; C23C16/06

Abstract:
A film formation method for selectively forming a film on a substrate includes: a preparation step of preparing a substrate having a surface on which a first film and a second film are exposed; a first film forming step of supplying a compound for forming a self-assembled monolayer onto the substrate to form the self-assembled monolayer on the first film, the compound having a functional group including fluorine and carbon and suppressing formation of a third film; a second film forming step of forming the third film on the second film; and a first removal step of removing the third film formed in a vicinity of the self-assembled monolayer by irradiating the surface of the substrate with ions or active species, wherein the third film is a film which forms a volatile compound more easily than the first film by being bonded to fluorine and carbon in the self-assembled monolayer.
Information query
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