Invention Application
- Patent Title: MEMORY DEVICES INCLUDING HEATERS
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Application No.: US17866903Application Date: 2022-07-18
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Publication No.: US20220351755A1Publication Date: 2022-11-03
- Inventor: Tomoko Ogura Iwasaki , Foroozan Koushan , Jayasree Nayar , Ji-Hye Gale Shin
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID BOISE
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID BOISE
- Main IPC: G11C5/02
- IPC: G11C5/02 ; H01L27/11524 ; H01L27/1157 ; H01L27/11529

Abstract:
Memory devices might include an array of memory cells, a plurality of access lines, and a heater. The array of memory cells might include a plurality of strings of series-connected memory cells. Each access line of the plurality of access lines might be connected to a control gate of a respective memory cell of each string of series-connected memory cells of the plurality of strings of series-connected memory cells. The heater might be adjacent to an end of each access line of the plurality of access lines.
Public/Granted literature
- US11694727B2 Memory devices including heaters Public/Granted day:2023-07-04
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