Invention Application
- Patent Title: CVD DEVICE PUMPING LINER
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Application No.: US17869706Application Date: 2022-07-20
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Publication No.: US20220356574A1Publication Date: 2022-11-10
- Inventor: Sheng-chun YANG , Yi-Ming LIN , Chih-tsung LEE , Yun-Tzu CHIU , Chao-Hung WAN
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: C23C16/44
- IPC: C23C16/44 ; C23C16/458 ; C23C16/50 ; C23C16/455

Abstract:
Pumping liners for use in an apparatus for depositing a material on a work piece by chemical vapor deposition includes a plurality of unevenly spaced apertures are disclosed. Uneven spacing of the plurality of apertures produces a uniform flow of processing gases within a processing chamber with which the pumping liner is associated. Films of materials deposited onto a work piece by chemical vapor deposition techniques using disclosed pumping liners exhibit desirable properties such as uniform thickness and smooth and uniform surfaces.
Information query
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