Various embodiments of the present disclosure are directed towards a chemical mechanical polishing (CMP) system including a first CMP head and a second CMP head. The first CMP head is configured to retain a workpiece and comprises a first plurality of pressure elements disposed across a first pressure control plate. The second CMP head is configured to retain the workpiece. The second CMP head comprises a second plurality of pressure elements disposed across a second pressure control plate. A distribution of the first plurality of pressure elements across the first pressure control plate is different from a distribution of the second plurality of pressure elements across the second pressure control plate.