Invention Application
- Patent Title: MICROELECTROMECHANICAL SENSING APPARATUS WITH CALIBRATION FUNCTION
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Application No.: US17539686Application Date: 2021-12-01
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Publication No.: US20220365040A1Publication Date: 2022-11-17
- Inventor: Chung-Yuan SU , Chin-Fu KUO , Liang-Ying LIU , Chao-Ta HUANG
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TW110115515 20210429
- Main IPC: G01N29/30
- IPC: G01N29/30 ; G01N29/24

Abstract:
A microelectromechanical sensing apparatus with calibration function comprises a microelectromechanical sensor and an IC chip. The microelectromechanical sensor comprises a proof mass, a movable driving electrode and a movable sensing electrode disposed on the proof mass, and a stationary driving electrode and stationary sensing electrode disposed on a substrate, wherein the sensing electrodes output a sensing signal when the proof mass vibrates. The IC chip comprises a conversion module electrically connected to the microelectromechanical sensor, wherein the conversion module converts the sensing signal into an input spectrum signal, and a calibration module electrically connected to the conversion module, wherein the calibration module receives the input spectrum signal and transforms the input spectrum signal into an output spectrum signal; wherein, the output spectrum signal is equal amplitude spectrum signal when the microelectromechanical sensor is subjected to an equal amplitude vibration and the input spectrum signal is an unequal amplitude spectrum signal.
Public/Granted literature
- US12025588B2 Microelectromechanical sensing apparatus with calibration function Public/Granted day:2024-07-02
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