Invention Application
- Patent Title: SRAM Cell and Logic Cell Design
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Application No.: US17883910Application Date: 2022-08-09
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Publication No.: US20220383944A1Publication Date: 2022-12-01
- Inventor: Fang Chen , Kuo-Chiang Ting , Jhon Jhy Liaw , Min-Chang Liang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: G11C11/412
- IPC: G11C11/412 ; G11C11/417 ; H01L27/11 ; H01L27/088 ; H03K19/20

Abstract:
An embodiment is an integrated circuit structure including a static random access memory (SRAM) cell having a first number of semiconductor fins, the SRAM cell having a first boundary and a second boundary parallel to each other, and a third boundary and a fourth boundary parallel to each other, the SRAM cell having a first cell height as measured from the third boundary to the fourth boundary, and a logic cell having the first number of semiconductor fins and the first cell height.
Public/Granted literature
- US11980015B2 SRAM cell and logic cell design Public/Granted day:2024-05-07
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