Invention Application
- Patent Title: COMPONENT MOUNTING DEVICE AND MANUFACTURING METHOD FOR MOUNTING SUBSTRATE
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Application No.: US17755223Application Date: 2020-08-04
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Publication No.: US20220386517A1Publication Date: 2022-12-01
- Inventor: HIDEAKI KATOU , NAOKI AZUMA , KOJI SAKURAI , MASANORI IKEDA
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Priority: JP2019-196074 20191029
- International Application: PCT/JP2020/029755 WO 20200804
- Main IPC: H05K13/00
- IPC: H05K13/00 ; H05K13/04

Abstract:
A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.
Public/Granted literature
- US11991831B2 Component mounting device and manufacturing method for mounting substrate Public/Granted day:2024-05-21
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