公开(公告)号：US20220287212A1

公开(公告)日：2022-09-08

申请号：US17637101

申请日：2020-06-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SYOICHI NISHI ,  HIDEKI SUMI ,  HIROSHI MURATA ,  KOJI SAKURAI ,  KENICHI ICHIKAWA

IPC: H05K13/08

Abstract: A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.

公开(公告)号：US20190242558A1

公开(公告)日：2019-08-08

申请号：US16247748

申请日：2019-01-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIDEAKI KATOU ,  KOJI SAKURAI ,  MASANORI IKEDA ,  NAOKI AZUMA

IPC: F21V19/00 ,  G01D5/26 ,  H05K13/00 ,  H01L27/15 ,  H01L25/075 ,  H01L33/00 ,  F21V14/02

CPC classification number: F21V19/0025 ,  F21V14/02 ,  G01D5/26 ,  H01L25/0753 ,  H01L27/156 ,  H01L33/005 ,  H05K13/0015

Abstract: A light emitting component mounter includes a luminance distribution measurer, a head moving mechanism, and a component mounting processor. The luminance distribution measurer causes the light to emit a light and measures a luminance distribution of a light emitter and detects a position of a luminance distribution center in the light emitter based on the measured luminance distribution. The head moving mechanism moves a mounting head. The component mounting processor controls the head moving mechanism based on the position detected by the luminance distribution measure.

公开(公告)号：US20190090393A1

公开(公告)日：2019-03-21

申请号：US16123122

申请日：2018-09-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TETSUYA TANAKA ,  MASAHIKO AKASAKA ,  KOJI SAKURAI ,  TOSHIHIKO NAGAYA

IPC: H05K13/04 ,  H05K3/12 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34

Abstract: There is provided a component mounting method for mounting an electronic component provided with a connecting pin on a board having a through-hole, including inserting the pin of the electronic component into an inner hole filled with solder paste at a first electrode provided in the through-hole to execute a component mounting operation of lowering the pin to a predetermined mounting height position and pulling up the pin once inserted and lowered into the inner hole in the component mounting operation to a preset intermediate height position.

公开(公告)号：US20220386517A1

公开(公告)日：2022-12-01

申请号：US17755223

申请日：2020-08-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIDEAKI KATOU ,  NAOKI AZUMA ,  KOJI SAKURAI ,  MASANORI IKEDA

IPC: H05K13/00 ,  H05K13/04

Abstract: A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.

公开(公告)号：US20190254174A1

公开(公告)日：2019-08-15

申请号：US16268519

申请日：2019-02-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TETSUYA TANAKA ,  MASAHIKO AKASAKA ,  KOJI SAKURAI ,  TOSHIHIKO NAGAYA

IPC: H05K3/34 ,  B23K1/00 ,  B23K1/20 ,  H05K13/04

CPC classification number: H05K3/3447 ,  B23K1/0016 ,  B23K1/203 ,  B23K2101/42 ,  H05K3/3484 ,  H05K3/3489 ,  H05K13/0409 ,  H05K2203/0126 ,  H05K2203/0139

Abstract: In component mounting for mounting a pin connecting component having a pin on a board having a through-hole electrode, a solder paste is printed on the through-hole electrode through a screen mask having an opening corresponding to the through-hole electrode, a flux is transferred onto the pin by holding the pin connecting component and immersing the pin into a flux tank filled with the flux, and the pin onto which the flux is transferred is inserted into the through-hole electrode on which the solder paste is printed to mount the pin connecting component on the board.

公开(公告)号：US20170354068A1

公开(公告)日：2017-12-07

申请号：US15595981

申请日：2017-05-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： SHINJI YAMAMOTO ,  KOJI SAKURAI ,  HIROYUKI FUJIWARA

IPC: H05K13/00 ,  H05K13/04

CPC classification number: H05K13/0015 ,  H05K13/0061 ,  H05K13/0069 ,  H05K13/04 ,  Y10T29/53174

Abstract: A lower surface of a board arranged at a working position is supported by a board supporter, and heights of a plurality of portions of the lower surface of the board are measured by a plurality of height measuring instruments attached to the board supporter. A component is installed on the board by control of a height of the installation of the component by an installation head and with respect to the board, which has the lower surface supported by the board supporter, being performed based on the height of the plurality of portions of the lower surface of the board measured by the plurality of height measuring instruments.