COMPONENT MOUNTING DEVICE AND MANUFACTURING METHOD FOR MOUNTING SUBSTRATE

    公开(公告)号:US20220386517A1

    公开(公告)日:2022-12-01

    申请号:US17755223

    申请日:2020-08-04

    IPC分类号: H05K13/00 H05K13/04

    摘要: A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.