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公开(公告)号：US20240262550A1
公开(公告)日：2024-08-08
申请号：US18637720
申请日：2024-04-17
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
CPC classification number: B65B15/04 , B65G47/68 , H05K13/02 , H05K13/0417
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US20220386517A1
公开(公告)日：2022-12-01
申请号：US17755223
申请日：2020-08-04
Inventor： HIDEAKI KATOU , NAOKI AZUMA , KOJI SAKURAI , MASANORI IKEDA
Abstract: A component mounting device is configured to mount, on a substrate, an electronic component having a functional unit. The component mounting device includes a component supply mechanism, a recognition unit, a component mounting mechanism, and a holding position determination unit. The component supply mechanism supplies the electronic component. The recognition unit recognizes a position of the functional unit. The component mounting mechanism holds the electronic component supplied from the component supply mechanism and mounts the electronic component on the substrate. The holding position determination unit determines a holding position of the electronic component by the component mounting mechanism based on the position of the functional unit recognized by the recognition unit.
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公开(公告)号：US20220127028A1
公开(公告)日：2022-04-28
申请号：US17647196
申请日：2022-01-06
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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Patent Agency Ranking
公开(公告)号：US20200346800A1
公开(公告)日：2020-11-05
申请号：US16930458
申请日：2020-07-16
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
Abstract: There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US20230331413A1
公开(公告)日：2023-10-19
申请号：US18339403
申请日：2023-06-22
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US20230146855A1
公开(公告)日：2023-05-11
申请号：US18150874
申请日：2023-01-06
Inventor： HIROKI KOBAYASHI , NAOKI AZUMA , CHIKARA TAKATA , YUZO ASANO , TORU CHIKUMA , HIROSHI SATOH
Abstract: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.
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公开(公告)号：US20190242558A1
公开(公告)日：2019-08-08
申请号：US16247748
申请日：2019-01-15
Inventor： HIDEAKI KATOU , KOJI SAKURAI , MASANORI IKEDA , NAOKI AZUMA
CPC classification number: F21V19/0025 , F21V14/02 , G01D5/26 , H01L25/0753 , H01L27/156 , H01L33/005 , H05K13/0015
Abstract: A light emitting component mounter includes a luminance distribution measurer, a head moving mechanism, and a component mounting processor. The luminance distribution measurer causes the light to emit a light and measures a luminance distribution of a light emitter and detects a position of a luminance distribution center in the light emitter based on the measured luminance distribution. The head moving mechanism moves a mounting head. The component mounting processor controls the head moving mechanism based on the position detected by the luminance distribution measure.
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8.发明申请公开(公告)号：US20180272378A1
公开(公告)日：2018-09-27
申请号：US15898912
申请日：2018-02-19
Inventor： YOSHINORI ISOBATA , MASAYUKI MANTANI , NAOKI AZUMA , SEIJI MIZUOKA , TAKAHIRO ENDO
Abstract: A workpiece holding body holding a workpiece having a three-dimensional shape is swung around a lateral swing axis to position the workpiece so that one mounting surface of the workpiece faces a predetermined worked direction and a viscous substance is printed on the one mounting surface of the workpiece which is positioned. The workpiece holding body is swung around the swing axis to position the workpiece so that another mounting surface of the workpiece in which the viscous substance is printed on one mounting surface faces the worked direction and to print the viscous substance on the other mounting surface of the workpiece which is positioned.
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