METHOD FOR PARTICLE REMOVAL FROM WAFERS THROUGH PLASMA MODIFICATION IN PULSED PVD
Abstract:
Physical vapor deposition methods for reducing the particulates deposited on the substrate are disclosed. The pressure during sputtering can be increased to cause agglomeration of the particulates formed in the plasma. The agglomerated particulates can be moved to an outer portion of the process chamber prior to extinguishing the plasma so that the agglomerates fall harmlessly outside of the diameter of the substrate.
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