Invention Application
- Patent Title: HIGH DENSITY MEMORY WITH REFERENCE MEMORY USING GROUPED CELLS AND CORRESPONDING OPERATIONS
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Application No.: US17368705Application Date: 2021-07-06
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Publication No.: US20230007890A1Publication Date: 2023-01-12
- Inventor: Teng-Hao YEH , Hang-Ting LUE , Cheng-Lin SUNG , Yung-Feng LIN
- Applicant: Macronix International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: G11C11/4091
- IPC: G11C11/4091 ; G11C11/408 ; G11C11/4094 ; G11C11/4099 ; G11C11/4074 ; G11C16/10 ; G11C16/28

Abstract:
A memory device includes a high density or 3D data memory and a 3D reference memory. The reference memory is used to generate a reference signal used to sense data in the data memory. Conversion circuitry converts signals from one memory cell or a group of memory cells in the reference memory into a reference signal. The reference signal is applied to a sense amplifier to sense data stored in a selected memory cell in the data memory.
Public/Granted literature
- US11710519B2 High density memory with reference memory using grouped cells and corresponding operations Public/Granted day:2023-07-25
Information query
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