Invention Application
- Patent Title: INTEGRATED CIRCUIT
-
Application No.: US17947288Application Date: 2022-09-19
-
Publication No.: US20230013938A1Publication Date: 2023-01-19
- Inventor: Yuki Sato , Kenji Otake , Takafumi Ando , Jeffrey Morroni , Charles Allen Devries, JR. , Kristen Nguyen Parrish
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L49/02 ; H01L23/31 ; H01L21/78 ; H01L21/48 ; H01L21/56 ; H01L23/495
Abstract:
An integrated circuit includes a substrate having an electronic component. A substrate-based coil is on the substrate. The coil is electrically coupled to the electronic component. A magnetic mold compound encapsulates the coil and the electronic component.
Information query
IPC分类:
