Invention Application
- Patent Title: BATTERY MODULE HOUSING COOLING ASSEMBLY
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Application No.: US17375753Application Date: 2021-07-14
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Publication No.: US20230017290A1Publication Date: 2023-01-19
- Inventor: Farzad Samie , Anthony Michael Coppola , Jian Gao , Derek Frei Lahr , Velmurugan Ayyanar , SeungHwan Keum
- Applicant: GM Global Technology Operations LLC
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Main IPC: H01M10/6556
- IPC: H01M10/6556 ; H05K7/20 ; H01M10/0525 ; H01M10/613 ; H01M10/625 ; H01M10/653 ; H01M50/204 ; H01M50/249

Abstract:
According to several aspects of the present disclosure, a battery module housing cooling assembly is disclosed. The battery module housing cooling assembly can include an endwall including a first polymer plate and a second polymer plate that define a slot therebetween. At least one of the first polymer plate or the second polymer plate define a channel therein that is configured to receive a coolant fluid, and the slot is configured to receive an electrical connector. The battery module housing cooling assembly can also include a cooling plate defining a first connection port and a second connection port, wherein the first connection port and a second connection port are configured to provide the coolant fluid to the channel.
Public/Granted literature
- US11728535B2 Battery module housing cooling assembly Public/Granted day:2023-08-15
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