Invention Publication
- Patent Title: POLISHING COMPOSITION AND POLISHING METHOD
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Application No.: US17910895Application Date: 2021-03-04
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Publication No.: US20230174821A1Publication Date: 2023-06-08
- Inventor: Kohsuke TSUCHIYA , Taiki ICHITSUBO
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu-shi, Aichi
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu-shi, Aichi
- Priority: JP 20044714 2020.03.13
- International Application: PCT/JP2021/008368 2021.03.04
- Date entered country: 2022-09-12
- Main IPC: C09G1/02
- IPC: C09G1/02
Abstract:
Provided is a polishing composition that contains a cellulose derivative and can improve the polishing removability and enhance the wettability of a polished surface of a silicon wafer. The polishing composition contains an abrasive, a cellulose derivative, a basic compound, and water. Here, the polishing composition has a zeta potential of -24.0 mV or more.
Information query
