Invention Publication
- Patent Title: SUBSTRATE SUPPORT UNIT, METHOD OF MANUFACTURING THE SAME, AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
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Application No.: US18073437Application Date: 2022-12-01
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Publication No.: US20230178409A1Publication Date: 2023-06-08
- Inventor: Jun Seok PARK , Chul Ho JUNG , Sang Kee LEE
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR 20210170956 2021.12.02
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/324 ; H01L21/67 ; H01L21/687
Abstract:
Proposed is a substrate support unit, a method of manufacturing the same, and a substrate processing apparatus including the same. The substrate support unit includes a base component, a chucking component mounted on the base component, and an intermediate layer interposed between the base component and the chucking component, wherein the intermediate layer includes a joining part formed in a partial region to couple the base component and the chucking component.
Public/Granted literature
- US2231240A Torque measuring wrench Public/Granted day:1941-02-11
Information query
IPC分类:
