Invention Publication
- Patent Title: SUBSTRATE CARRIER DETERIORATION DETECTION AND REPAIR
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Application No.: US18170962Application Date: 2023-02-17
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Publication No.: US20230191619A1Publication Date: 2023-06-22
- Inventor: Jen-Ti Wang , Chih-Wei Lin , Fu-Hsien Li , Yi-Ming Chen , Cheng-Ho Hung
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- The original application number of the division: US17114178 2020.12.07
- Main IPC: B25J11/00
- IPC: B25J11/00 ; G01B11/30 ; H01L21/67

Abstract:
A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.
Public/Granted literature
- US12162134B2 System with substrate carrier deterioration detection and repair Public/Granted day:2024-12-10
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