公开(公告)号：US12162134B2

公开(公告)日：2024-12-10

申请号：US18170962

申请日：2023-02-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jen-Ti Wang ,  Chih-Wei Lin ,  Fu-Hsien Li ,  Yi-Ming Chen ,  Cheng-Ho Hung

IPC: B25J11/00 ,  B23P6/00 ,  B25J1/04 ,  B25J18/00 ,  G01B11/24 ,  G01B11/30 ,  G01N33/00 ,  H01L21/02 ,  H01L21/66 ,  H01L21/673 ,  H01L21/677

Abstract: A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.

公开(公告)号：US20210118665A1

公开(公告)日：2021-04-22

申请号：US17114178

申请日：2020-12-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jen-Ti Wang ,  Chih-Wei Lin ,  Fu-Hsien Li ,  Yi-Ming Chen ,  Cheng-Ho Hung

IPC: H01L21/02 ,  H01L21/66 ,  G01B11/24 ,  G01N33/00 ,  H01L21/673 ,  H01L21/677 ,  B23P6/00

Abstract: An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.

公开(公告)号：US11854844B2

公开(公告)日：2023-12-26

申请号：US17842340

申请日：2022-06-16

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chi-Yuan Chu ,  Jen-Ti Wang ,  Wei-Chih Chen ,  Kuo-Fong Chuang ,  Cheng-Ho Hung

IPC: H01L21/67 ,  H01L21/677

CPC classification number: H01L21/67242 ,  H01L21/6773 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67265 ,  H01L21/67724 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67766

Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.

公开(公告)号：US11584019B2

公开(公告)日：2023-02-21

申请号：US17114178

申请日：2020-12-07

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jen-Ti Wang ,  Chih-Wei Lin ,  Fu-Hsien Li ,  Yi-Ming Chen ,  Cheng-Ho Hung

IPC: B25J11/00 ,  G01B11/30 ,  H01L21/67 ,  H01L21/02 ,  H01L21/66 ,  B25J18/00 ,  G01B11/24 ,  G01N33/00 ,  H01L21/673 ,  H01L21/677 ,  B23P6/00 ,  B25J1/04

Abstract: An apparatus for semiconductor manufacturing includes an input port to receive a carrier, wherein the carrier includes a carrier body, a housing installed onto the carrier body, and a filter installed between the carrier body and the housing. The apparatus further includes a first robotic arm to uninstall the housing from the carrier and to reinstall the housing into the carrier; one or more second robotic arms to remove the filter from the carrier and to install a new filter into the carrier; and an output port to release the carrier to production.

公开(公告)号：US20190131119A1

公开(公告)日：2019-05-02

申请号：US15794352

申请日：2017-10-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jen-Ti Wang ,  Chih-Wei Lin ,  Fu-Hsien Li ,  Yi-Ming Chen ,  Cheng-Ho Hung

IPC: H01L21/02 ,  H01L21/66 ,  H01L21/673 ,  G01B11/24 ,  G01N33/00

Abstract: A method includes receiving a carrier with a plurality of wafers inside; supplying a purge gas to an inlet of the carrier; extracting an exhaust gas from an outlet of the carrier; and generating a health indicator of the carrier while performing the supplying of the purge gas and the extracting of the exhaust gas.

公开(公告)号：US20230191619A1

公开(公告)日：2023-06-22

申请号：US18170962

申请日：2023-02-17

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jen-Ti Wang ,  Chih-Wei Lin ,  Fu-Hsien Li ,  Yi-Ming Chen ,  Cheng-Ho Hung

IPC: B25J11/00 ,  G01B11/30 ,  H01L21/67

CPC classification number: B25J11/008 ,  G01B11/306 ,  H01L21/67005 ,  H01L21/0201

Abstract: A system includes a plurality of semiconductor processing tools; a carrier purge station; a carrier repair station; and an overhead transport (OHT) loop for transporting one or more substrate carriers among the plurality of semiconductor processing tools, the carrier purge station, and the carrier repair station. The carrier purge station is configured to receive a substrate carrier from one of the plurality of semiconductor processing tools, purge the substrate carrier with an inert gas, and determine if the substrate carrier needs repair. The carrier repair station is configured to receive a substrate carrier to be repaired and replace one or more parts in the substrate carrier.

公开(公告)号：US11367637B2

公开(公告)日：2022-06-21

申请号：US16787966

申请日：2020-02-11

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Chi-Yuan Chu ,  Jen-Ti Wang ,  Wei-Chih Chen ,  Kuo-Fong Chuang ,  Cheng-Ho Hung

IPC: H01L21/67 ,  H01L21/677

Abstract: A method of operating a transport system includes detecting an anomalous condition of a wafer transfer vehicle; sending the wafer transfer vehicle along a rail to a diagnosis station adjacent to the rail; and inspecting properties of the wafer transfer vehicle, such as a speed, a weight, an audio frequency, a noise level, a temperature, and an image of the wafer transfer vehicle, by using the diagnosis station.

公开(公告)号：US10861692B2

公开(公告)日：2020-12-08

申请号：US15794352

申请日：2017-10-26

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Jen-Ti Wang ,  Chih-Wei Lin ,  Fu-Hsien Li ,  Yi-Ming Chen ,  Cheng-Ho Hung

IPC: H01L21/02 ,  G01N33/00 ,  B23P6/00 ,  H01L21/66 ,  G01B11/24 ,  H01L21/673 ,  H01L21/677 ,  B25J18/00 ,  B25J1/04

Abstract: A method includes receiving a carrier with a plurality of wafers inside; supplying a purge gas to an inlet of the carrier; extracting an exhaust gas from an outlet of the carrier; and generating a health indicator of the carrier while performing the supplying of the purge gas and the extracting of the exhaust gas.